SYSMELEC OptoBonder 200 Semi Automatic Flip Bonder


1 in stock

Ask a product question
SKU 57103
Location Area A Rear
Cosmetic Condition 4 - Excellent
Product Condition Used
Container Self
OEM SKU OptoBonder 200

This is a SYSMELEC OptoBonder 200.
OPus-Optique & Micro Systemes.
This piece is in “like new” condition it appears not to have been used.
Featured Photo is representative. We have the main unit, the controller and a large box of options/ equipment that came with it.
Photos following the representative photo are of the actual pieces included in this sale that were very recently put into storage at our warehouse.
The unit was packaged very tightly for shipment and the photos reflect this.

The sale of this OPTOBONDER 200 includes the following:
Optobonder head with Motorized Theta, Motorized Focus, High Resolution Camera for Alignment
and Large field Inspection Cameras, Autoplace 448 Controller, Autoplace 448 Controller, X-Y Robot, 800mm x 150mm, PC, Frame Grabber,
LCD, Software & System Frame, Thermode and various other optional items that buyer should recognize.

Interested buyers may give us a call at 781-871-8868 to make an appointment to come inspect this unit at our warehouse.
This piece was originally purchased through CWI Technical Sales.
BMI Surplus will consider reasonable offers on this OptoBonder 200.

We do not have extensive knowledge on how this machine is operated.
Please call us to make an appointment, to request photos of the actual unit and for more information..

The literature that came with this unit gives the following information;

Semi Automatic Flip Chip for OptoElectronic Components. The Opus OptBonder semi-automatic flip chip bonder offers the latest innovation in bonding techniques focused on optoelectronic devices.
The OptoBonder supports a complete range of bonding processes” thermocompression, local soldering with pulse heating of component neutral or active atmosphere soldering and high vacuum
reflow soldering.

Model 200 semi automatic flip chip bonder is specifically designed for R&D and medium volume production applications. Chip and substrate inputs are waffle pack or gel packs and can have random
location and orientation in cells. Alignment sequence for pre-bonding phase is manual. Picking of chips and substrates is automatic.

Multiple optical fields for alignment and inspection..

BMI Surplus, Inc. has a huge inventory of used, new and pre-owned Semiconductor Processing Equipment for sale.
We will work with you individually to find the perfect set up for your application..

Buy online or give us a call at 781-871-8868. We have experienced customer service representatives standing by ready to help you!

BMI Surplus, Inc. is a dealer in used and sometimes new Surplus Scientific & Industrial Equipment – we cater to clients in search of items to be used for specific applications.
We do not offer a guarantee as many of our items are purchased by professionals in need of parts and pieces.
You will find many of our items listed on our website as untested or as parts or repair units even though in they are in good used condition..

**Shipping, Handling & Freight fees are dependent on your location.
We will provide a freight quote to meet your individual needs and work with you if you prefer to use your own carrier.
We have 33 years of experience shipping sensitive scientific instruments & industrial equipment!!!

Don’t see what you are looking for? Use our orange search box on the top right hand corner of this page to customize your search.

***MPN OptoBonder 200
***SKU*** 57103

SKU: 57103 Categories: , , ,